I Elprint benytter vi stadigvæk vores velkendte MIX-princip, hvor standardopbygninger af 1-, 2-, og 4-lags print bliver mixet med andre print, der bærer samme specifikationer. Hermed opnår du en bedre udnyttelse af produktionspanelet og der er flere til at ”deles” om opstartsomkostningerne. Dette medfører, at du som kunde får lavere priser på print, som kan mixes. Her på siden kan du se vores kapabilitet – både hvad angår standard printkort på mix og vores generelle kapabiliteter for alle typer af printkort.
For at dit print kan mixes, skal det opfylde nogle krav, som er specificeret i boksen umiddelbart herunder.
For flere tekniske oplysninger kan du med fordel læse nærmere om printkort her på siden eller på www.macaos.com.
Hent en printervenlig PDF af vores kapabiliteter her (73.1 Kb)
| A | Finished hole size. Plated or non plated |
| B | Annular ring: (pad size – hole size) / 2 |
| C | Soldermask opening |
| D | Conductor width |
| E | Conductor spacing |
| F | Solder mask bridge |
| G | NPTH to copper |
Generel kapabilitet
| Standard | Special | |
| Production standard | IPC 6012C, Class 2 |
IPC 6012C, Class 3 Perfag Any special requirements |
| Production time | 5 days | 1-2 days |
| Shipment time | 2 days | 1 day. 3 days -3 weeks on series |
| Base materials |
FR4 FR4 High TG |
Rogers Aluminium core/carrier Polyimide (flex & rigid) Arlon |
| Product Range |
Single sided, double sided Multilayer (4-16 layers) Prototypes Small & large production series |
Multilayer (16 – 52 layers) High density interconnect (HDI) Flex, Rigid-Flex Metal core/carrier (Alu) Impedance controlled PCBs |
| Board size |
Min 25×25, if smaller PCB must be panelized Max 500×600 mm |
Max 520-720 mm?? |
| PCB thickness | 1.6 mm standard, ± 10% |
FR4: 0.1 – 6.0 mm Min. inner layer: 0.05 mm |
| Copper thickness |
35µ Plating: 20µ for IPC Class 2 |
12-200µ Plating: 25µ for IPC Class 3 |
| Surface finish |
Lead free HASL ENIG (chem. NiAu) |
Silver Chemical Tin Hard Gold HASL (Non RoHS, with lead) |
| Mechanical processing |
Routing (2.4, 2.0, 1.6 mm) Routing tolerance: ±0.20 mm Scoring (PCB thicnkess: 0.8-2.4 mm) Scoring, min dist. Copper: 0.4 mm |
Min. routing tool: 0.6 mm dia. Routing tolerance: ±0.10 mm Plated edges Depth controlled routing Castellated holes (half moon holes) Blind & buried vias Peelable (blue) mask |
| Holes |
Mechanical: 0.25-6.2 mm Aspect ratio Through hole: 1:10 Aspect ratio blind hole: 1:1 Finished hole dia. tolerance: ± 0.1 mm. |
Mechnical: 0.10 mm Laser drill: 0.1 mm (0.07 mm possible) Aspect ratio Through hole: 1:20 Plugging: with solder mask, copper, non conductive paste. Overplate possible. |
| Solder mask |
Color: Green Bridge (F): 0.1 mm Over size (C): 0.1 mm Thickness, typical: 8-40µ |
Color: Red, white, black & blue Bridge (F): 0.07 mm Over size (C): 0.050 mm |
| Component printing |
Color: White Minimum line width: 0.125 mm |
Color: Yellow & Black Minimum line width: 0.1 mm |
| Data formats |
Macaos orders Gerber Extended, drill files ODB++ |
Basic Gerber pdf, doc, xls ect. |
|
Minimum distances: – Npt – copper – Outline – copper – Scoring – copper – Copper – copper |
See tables below 0.2 mm 0.4 mm See tables below |
See tables below 0.1 mm 0.3 mm See tables below |
Outer layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness | Line width (D) | Line space (E) | NPTH – copper (G) |
| 18µ (43 plated)* | 150µ (100µ)** | 150µ (100µ)** | 200µ (150µ) |
| 35µ (70 plated) | 200µ (150µ) | 200µ (150µ) | 225µ (175µ) |
| 70µ (105 plated) | 300µ (250µ) | 300µ (250µ) | 250µ (200µ) |
| 105 (140 plated) | 400µ (300µ) | 400µ (350µ) | 300µ (250µ) |
| 140µ | 500µ (400µ) | 500µ (400µ) | 400µ (300µ) |
| 210µ | 600µ (500µ) | 600µ (500µ) | 500µ (400µ) |
| *) Commonly known as 35µ/1oz. | |||
| **) Down to 50µ width/space on 9µ base copper. |
Inner layer, copper thickness and line/space. Cheapest (Minimum)
| Starting copper thickness | Line width (D | Line space (E) | NPTH – copper (G) |
| 18µ | 125µ (75µ) | 125µ (75µ) | (300µ) |
| 35µ | 150µ (100µ) | 150µ (100µ) | (300µ) |
| 70µ | 250µ (200µ) | 250µ (200µ) | (300µ) |
| 105 | 300µ (250µ) | 300µ (250µ) | (300µ) |
| 140µ | 500µ (350µ) | 500µ (350µ) | (400µ) |
| 210µ | 600µ (500µ) | 600µ (500µ) | (500µ) |
Stenciler
| Maximum size | 595×595 mm |
| Thickness | 100, 120, 130, 150, 180, 200, 250µ |
| Treatment | Electro polished |
| Etching | Up to 2 thicknesses pr. stencil. Etch down in 10µ steps from base thickness. |
| Minimum opening size | 50µ |
| Minimum distance opening to opening | 150µ |